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Thin-Film Encapsulation (TFE) Market Size And Forecast
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Thin-Film Encapsulation (TFE) Market size was valued at USD 45.02 Million in 2019 and is projected to reach USD 210.59 Million by 2027, growing at a CAGR of 25.9% from 2020 to 2027.
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An increase in the requirement for the thin-film barrier in various flexible devices, a rise in the adoption rate of flexible OLED displays for smart devices, and increasing capital investments in OLED technology have been driving the global Thin-Film Encapsulation (TFE) Market. The Global Thin-Film Encapsulation (TFE) Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.
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Global Thin-Film Encapsulation (TFE) Market Definition
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Thin-film encapsulation (TFE) is an emerging form of technology for organic light-emitting diodes (OLED). TFE has the ability to replace the front glass layer with a thin-film barrier present in an OLED device. OLED material has a very susceptible nature to degradation when exposed to various environmental factors such as water and air. This technology is very challenging as its barrier film has a requirement of low water and oxygen permeation, the deposition must be done at a low temperature, and must last the shelf life of the OLED device. Increasing technological developments along with increments in investments have contributed to the Thin-Film Encapsulation (TFE) Market.
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Global Thin-Film Encapsulation (TFE) Market Overview
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An increase in the requirement for the thin-film barrier in various flexible devices, a rise in the adoption rate of flexible OLED displays for smart devices, and increasing capital investments in OLED technology have been driving the global Thin-Film Encapsulation (TFE) Market. On the other hand, lacking technological knowledge and expansion of flexible glass technology might hinder the overall market at a global level.
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Global Thin-Film Encapsulation (TFE) Market Segmentation Analysis
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The Global Thin-Film Encapsulation (TFE) Market is segmented based on Technology, Application, and Geography.
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Thin-Film Encapsulation (TFE) Market, By Technology
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• Plasma-enhanced chemical vapor deposition (PECVD)
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• Atomic layer deposition (ALD)
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• Inkjet printing
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• Vacuum Thermal Evaporation
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• Others
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Based on Technology, the market is segmented into Plasma-enhanced chemical vapor deposition (PECVD), Atomic layer deposition (ALD), Inkjet printing, Vacuum Thermal Evaporation, and Others.
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Thin-Film Encapsulation (TFE) Market, By Application
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• Flexible OLED Display
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• Thin-Film Photovoltaics
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• Flexible OLED Lighting
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• Others
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Based on Application, the market is segmented into Flexible OLED Display, Thin-Film Photovoltaics, Flexible OLED Lighting, and Others.
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Thin-Film Encapsulation (TFE) Market, By Geography
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• North America
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• Europe
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• Asia Pacific
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• Rest of the world
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On the basis of Geography, the Global Thin-Film Encapsulation (TFE) Market is classified into North America, Europe, Asia Pacific, and the Rest of the world.
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Key Players
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The “Global Thin-Film Encapsulation (TFE) Market” study report will provide a valuable insight with an emphasis on the global market including some of the major players such as Meyer Burger, LG Chem, Angstrom Engineering, Applied Materials, AMS Technologies, Samsung SDI, 3M, BASF (Rolic), Kateeva, Aixtron, Universal Display Corp. (UDC), and Veeco Instruments.
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Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis.
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Report Scope
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REPORT ATTRIBUTES | DETAILS |
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STUDY PERIOD |
2016-2027 _x000D_ |
BASE YEAR |
2019 _x000D_ |
FORECAST PERIOD |
2020-2027 _x000D_ |
HISTORICAL PERIOD |
2016-2018 _x000D_ |
UNIT |
Value (USD Million) _x000D_ |
KEY COMPANIES PROFILED |
Meyer Burger, LG Chem, Angstrom Engineering Applied Materials, AMS Technologies, Samsung SDI, 3M, BASF (Rolic), Kateeva, Aixtron, Universal Display Corp. (UDC), and Veeco Instruments _x000D_ |
SEGMENTS COVERED |
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CUSTOMIZATION SCOPE |
Free report customization (equivalent to up to 4 analysts’ working days) with purchase. Addition or alteration to country, regional & segment scope _x000D_ |
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Reasons to Purchase this Report
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Frequently Asked Questions
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What is the projected market size & growth rate of the Thin-Film Encapsulation (TFE) Market? _x000D_
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Thin-Film Encapsulation (TFE) Market was valued at USD 45.02 Million in 2019 and is projected to reach USD 210.59 Million by 2027, growing at a CAGR of 25.9% from 2020 to 2027._x000D_
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What are the key driving factors for the growth of the Thin-Film Encapsulation (TFE) Market? _x000D_
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An increase in the requirement for the thin-film barrier in various flexible devices, a rise in the adoption rate of flexible OLED displays for smart devices, and increasing capital investments in OLED technology have been driving the global Thin-Film Encapsulation (TFE) Market._x000D_
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What are the top players operating in the Thin-Film Encapsulation (TFE) Market? _x000D_
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The major players are Meyer Burger, LG Chem, Angstrom Engineering Applied Materials, AMS Technologies, Samsung SDI, 3M, BASF (Rolic), Kateeva, Aixtron, Universal Display Corp. (UDC), and Veeco Instruments._x000D_
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What segments are covered in the Thin-Film Encapsulation (TFE) Market Report? _x000D_
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The Global Thin-Film Encapsulation (TFE) Market is segmented based on Technology, Application, and Geography._x000D_
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How can I get a sample report/company profiles for the Thin-Film Encapsulation (TFE) Market? _x000D_
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The sample report for the Thin-Film Encapsulation (TFE) Market can be obtained on demand from the website. Also, the 24*7 chat support & direct call services are provided to procure the sample report._x000D_
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